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CMOS LDO Regulator Series for Portable Equipments
High-speed Load Response Full CMOS LDP Regulators
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
No.09020EBT06
Description BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX are high-performance 3ch FULL CMOS regulator with 200-mA outputs, which is mounted on small package VSON008X2030(2.0 mm 3.0 mm 0.6 mm). It has excellent noise characteristics and load responsiveness characteristics despite its low circuit current consumption of 120 A. It is most appropriate for various applications such as power supplies for logic IC, RF, and camera modules. Features 1) High-accuracy output voltage of 1% (25 mV on 1.5-V & 1.8-V products) 2) High ripple rejection: 70 dB (Typ., 1 kHz, VOUT1.8 V)) 3) Compatible with small ceramic capacitor (CIN=2.2F ,Co=1.0 F) 4) Low current consumption: 120 A 5) ON/OFF control pin(STBY) of output voltage 6) With built-in overcurrent protection circuit and thermal shutdown circuit 7) With built-in output discharge circuit 8) Adopting small package VSON008X2030
Applications Battery-powered portable equipment, etc.
Line up matrix 200 mA BU6650NUX BU6651NUX BU6652NUX BU6653NUX
BU665NUX series VOUT1 2.8V 2.8V 2.8V 2.8V VOUT2 2.8V 1.8V 2.8V 1.8V VOUT3 1.8V 1.5V 1.5V 1.8V VSON008X2030 Package
Product Name
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1/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Absolute maximum rating Parameter Maximum applied power voltage Power dissipation Maximum junction temperature Operational temperature range Storage temperature range
Technical Note
Symbol VMAX Pd TjMAX Topr Tstg
Limits -0.3 ~ 660* -40 ~ -55 ~ +125 +85 +125 +6.0
1
Unit V mW C C C
* When 1 PCB (70 mm 70 mm, thickness 1.6-mm glass epoxy) a standard ROHM board is implemented. Reduced to 6.6 mW/C when used at Ta=25C or higher.
Recommended operating range (Do not exceed Pd.) Parameter Symbol Input power supply voltage Maximum output current VIN IMAX
Limits 2.5 ~ 200 5.5
Unit V mA
Recommended operating conditions Parameter Input capacitor Output capacitor Symbol CIN CO Min. 1.0*
2 2
Typ. 2.2 1.0
Max.
Unit F F
Conditions A ceramic capacitor is recommended. A ceramic capacitor is recommended.
0.5*
*2 Set the capacity value of the capacitor so that it does not fall below the minimum value, taking temperature characteristics, DC device characteristics, and change with time into consideration.
2009. Jun.
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2/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Electrical characteristics (Ta=25C, VIN=VOUT+1.0 V (VIN=3.5V on VOUT=1.8V and1.5V products), STBY=1.5V,CIN=2.2F, CO=1.0F,unless otherwise specified) Parameter Output voltage Symbol VOUT IIN1 Operating current IIN2 IIN3 Circuit current (at STBY) ISTBY Min. VOUTx0.99 VOUT-25 mV Typ. VOUT 40 80 120 70 Ripple rejection RR 55 65 Input/Output voltage difference Line regulation Load regulation Overcurrent protection detection current Output short-circuit current Output discharge resistance Standby pull-down resistance ON Control Voltage OFF VSTBL -0.3 0.3 V VSAT VDL VDLO ILMAX ISHORT RDSC RSTB VSTBH 220 20 20 500 1.5 360 2 10 350 70 50 1000 720 20 80 700 150 80 2000 5.5 mV mV dB Max. VOUTx1.01 VOUT+25 mV 95 190 285 1 Unit V V A A A A
Technical Note
Conditions IOUT=10 AVOUT2.5 V IOUT=10 AVOUT<2.5 V IOUT=0mA STBYx1=1.5V, STBYx2=0V IOUT=0mA STBYx2=1.5V, STBYx1=0V IOUT=0mA STBYx3=1.5V STBY=0 V VRR=-20dBv, fRR=1kHz, IOUT=10 mA,1.5VVOUT1.8V VRR=-20dBv, fRR=1 kHz, IOUT=10 mA,2.5 VVOUT VOUT=2.8 V (VIN=0.98*VOUT, IOUT=200 mA) VIN=VOUT+1.0 V to 5.5 V, IOUT=10 A
mV IOUT=0.01 mA to 100 mA mA Vo=VOUT*0.8 mA Vo=0 V k V Output Voltage ON Output Voltage OFF VIN=4.0 V, STBY=0 V
* This product does not have radiation-proof design.
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3/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Block diagram, recommended circuit diagram, and PACKAGE DIMENSIONS (VSON008X2030)
Technical Note
VIN CIN VREF STBY1
Device Mark a
VOUT1 STBY COUT
OCP
VREF STBY2 VOUT2 STBY COUT
OCP
VREF STBY3 VOUT3 STBY COUT
OCP
Fig.1 Block diagram
Fig.2 PACKAGE DIMENSIONS Pin configuration diagram PIN No. PIN NAME 1 VIN 2 3 4 5 6 7 8 STBY1 STBY2 STBY3 GND VOUT3 VOUT2 VOUT1
DESCRIPTION INPUT Pin OUTPUT1 CONTROL Pin ( High : ON, Low : OFF ) OUTPUT2 CONTROL Pin ( High : ON, Low : OFF ) OUTPUT3 CONTROL Pin ( High : ON, Low : OFF ) GROUND Pin OUTPUT3 Pin OUTPUT2 Pin OUTPUT1 Pin
Device Mark Series Name BU6650NUX BU6651NUX BU6652NUX BU6653NUX Device Mark a U6650 U6651 U6652 U6653
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4/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Input/Output terminal equivalent circuit schematic 6,7,8pin (VOUT) 5pin (GND)
VIN
Technical Note
2,3,4pin (STBY)
VIN
1pin (VIN)
VOUT
STBY
Fig.3 About input/output capacitor
Input/Output equivalent circuit
Capacity value of ceramic capacitor - DC bias characteristics (Example) 10 0 -10 Capacitance Change [%] -20 -30 -40 -50 -60 -70 -80 -90 -100 0 0.5 1 1.5 2 2.5 3 3.5 4
10-V withstand voltage F characteristics 4-V withstand voltage X6S characteristics 10-V withstand voltage F characteristics 10-V withstand voltage B1characteristics GRM188B11A105KA61D
It is recommended to place a capacitor as close as possible to the pins between the input terminal and GND or between the output terminal and GND. The capacitor between the input terminal and GND becomes valid when source impedance increases or when wiring is long. The larger the capacity of the output capacitor between the output terminal and GND is, the better the stability and characteristics in output load fluctuation become. However, please check the status of actual implementation. Ceramic capacitors generally have variation, temperature characteristics, and direct current bias characteristics and the capacity value also decreases with time depending on the usage conditions. It is recommended to select a ceramic capacitor upon inquiring about detailed data of the related manufacturer.
10-V withstand voltage B characteristics 6.3-V withstand voltage B characteristics
DC Bias Voltage [V]
Fig.4 Capacity - bias characteristics
About the equivalent series resistance (ESR) of a ceramic capacitor Capacitors generally have ESR (equivalent series resistance) and it operates stably in the ESR-IOUT area shown on the right. Since ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different ESR, please check the ESR of the capacitor to be used and use it within the stability area range shown in the right graph for evaluation of the actual application.
100
Unstable area
ESR []
10 1 0.1 0.01 0 50 100 IOUT [mA] 150 200
Stability area
Fig.5 Stability area characteristics (Example)
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5/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Reference data total device (Ta=25C unless otherwise specified.)
Technical Note
50.00
100.00
150.00
Input Current (uA)
Input Current (uA)
Input Current (uA)
-15 10 35 60 85
40.00
80.00
120.00
30.00
60.00
90.00
20.00
40.00
60.00
10.00
20.00
30.00
0.00 -40
-15
10
35
60
85
0.00 -40
0.00 -40 -15 10 35 60 85
Temp (C)
Temp (C)
Temp (C)
Fig. 6. Iin1 vs. Temp
3.50
Fig. 7. Iin2 vs. Temp
Fig. 8. Iin3 vs. Temp
1.000 0.900 0.800
VIN=3.8V
3.00
Gnd Current (uA)
0.700 0.600 0.500 0.400 0.300 0.200 0.100 0.000 -0.100 -40 -15 10 35 60 85
Output Voltage (V)
2.50 2.00 1.50 1.00 0.50 0.00 0 0.5 1 1.5
VIN=3.8V STBY=0V
Temp.=85C Temp.=25C Temp.=-40C
Temp. (C)
STBY Voltage (V)
Fig. 9. IIstby vs Temp (STBY)
Fig. 10. STBY Threshold
Reference data Vo=2.8V (Ta=25C unless otherwise specified.)
3.5 3.0
2.85 2.84
100
IO=0uA
Output Voltage (V)
2.82 2.81 2.80 2.79 2.78 2.77 2.76 2.75
Gnd Current (uA)
2.5 2.0 1.5 1.0 0.5 0.0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 IO=0uA IO=100uA IO=50mA IO=200mA Temp.=25C VIN = STBY
Output Voltage (V)
2.83
IO=0uA IO=100uA IO=50mA IO=200mA
80 60 40 20 0
VIN = STBY
Temp.=25C VIN = STBY
2.7 2.8 2.9 3 3.1 3.2
Temp.=-40C Temp.=25C Temp.=85C
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 Vin Voltage (V)
Vin Voltage (V)
Vin Voltage (V)
Fig. 11. Output Voltage
Fig. 12. Line Regulation
Fig. 13. Circuit Current IGND
0.40 0.35
10
120 110
Dropout Voltage (V)
STBY Current (uA)
8
Gnd Current (uA)
0.30 0.25
Temp.=25C
Temp.=85C
Temp.=85C
100 90
Temp.=25C
Temp.=85C
6
Temp.=25C
0.20 0.15 0.10 0.05 0.00 0 0.05 0.1 0.15 0.2
VIN=0.98 x VOUT STBY = 1.5V Temp.=-40C
80 70 60 50 40
VIN = 3.8V STBY = 1.5V Temp.=-40C
4
Temp.=-40C
2
VIN = STBY
0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
0
0.05
0.1
0.15
0.2
Output Current (A)
STBY Voltage (V)
Output Currnt (A)
Fig. 14. Dropout Voltage
Fig. 15. STBY Input Current
Fig. 16. IOUT - IGND
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6/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Reference data Vo=2.8V (Ta=25C unless otherwise specified.)
Technical Note
2.85 2.84
Output Voltage (V)
Output Voltage (V)
2.83 2.82 2.81 2.80 2.79 2.78 2.77 2.76 2.75 -40 -15 10 35 60 85
VIN=3.8V STBY=1.5V Io=0.1mA
Temp. (C)
Fig. 17. Load Regulation
Fig. 18. OCP Threshold
Fig. 19. VOUT vs. Temp
80 70
80 70 Ripple Rejection [dB] 60 50 40 30 20 10 0
100 1000
f= 0 .1 kHz
1.6 O utput N oise D ensity [ V / H z] 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0.1 1 10 Frequency f [kHz] 100
Co=1.0F Cin=1.0F Iout=10mA temp=25
Ripple Rejection (dB )
60 50 40 30 20 10 0 0.1 1 10
Vin= 3.8V Io=10mA Ta = 25
f= 1 kH z f= 1 0 kH z
f= 1 0 0 kH z Co=1.0F Cin=none Iout=10mA temp=25
2.8
3.8
4.8
Frequency (kHz)
Input Voltage VIN[V]
Fig. 20. Ripple Rejection VS Freq.
Fig. 21. Ripple Rejection VS VIN
Fig. 22. Output Noise Spectral Density VS. Freq.
Fig. 23. Load Response
Fig. 24. Load Response
Fig. 25. Load Response
Fig. 26. Load Response
Fig. 27. Load Response Current Pulse=10kHz
Fig. 28. Load Response Current Pulse=10kHz
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7/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Reference data Vo=2.8V (Ta=25C unless otherwise specified.)
Technical Note
Fig. 29. Load Response Current Pulse=100kHz
Fig. 30. Load Response Current Pulse=100kHz
Fig. 31. Start Up Time Iout = 0mA
Fig. 32. Start Up Time Iout = 200mA
Fig. 33. Start Up Time (STBY=VIN) Iout = 0mA
Fig. 34. Start Up Time(STBY=VIN) Iout = 200mA
Fig. 35. Discharge Time Iout = 0mA
Fig. 36. VIN Response Iout = 10mA
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8/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Reference data Vo=1.8V (Ta=25C unless otherwise specified.)
Technical Note
3.5 3.0
1.85 1.84
100
Output Voltage (V)
Output Voltage (V)
2.5 2.0 1.5 1.0 0.5 0.0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 IO=0uA IO=100uA IO=50mA IO=200mA
1.82 1.81 1.80 1.79 1.78 1.77 1.76 1.75 1.75 1.85 1.95 2.05
Gnd Current (uA)
1.83
IO=0uA IO=100uA IO=50mA IO=200mA
80
60
40
Temp=25C VIN = STBY
Temp=25C VIN = STBY
2.15 2.25 2.35
20
Temp=-40C Temp=25C Temp=85C
IO=0uA VIN = STBY
4 4.5 5 5.5
0 0 0.5 1 1.5 2 2.5 3 3.5
Vin Voltage (V)
Vin Voltage (V)
Vin Voltage (V)
Fig. 37. Output Voltage
Fig. 38. Line Regulation
Fig. 39. Circuit Current IGND
140 120
10
120 110
STBY Current (uA)
Gnd Current (uA)
8
Temp=85C Temp=25C Temp=-40C
Temp=85C Temp=25C
Gnd Current (uA)
100 90 80 70 60 50
100 80 60 40 20 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
6
4
Temp=-40C Temp=25C Temp=85C
Temp=-40C
IO=200mA VIN = STBY
2
VIN = STBY
0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
40 0 0.05 0.1
VIN = 3.5V STBY = 1.5V
0.15 0.2
Vin Voltage (V)
STBY Voltage (V)
Output Current (A)
Fig. 40. Circuit Current IGND
Fig. 41. STBY Input Current
Fig. 42. IOUT - IGND
3.50 3.00
Output Voltage (V)
Output Voltage (V)
Output Voltage (V)
2.50 2.00 1.50 1.00 0.50 0.00 0 0.5 1 1.5
Temp=85C Temp=25C Temp=-40C
STBY Voltage (V)
Fig. 43. Load Regulation
Fig. 44. OCP Threshold
Fig. 45. STBY Threshold
1.85 1.84
50.00
Output Voltage (V)
1.82 1.81 1.80 1.79 1.78 1.77 1.76 1.75 -40 -15 10 35 60 85
Input Current (uA)
1.83
40.00
30.00
20.00
VIN=3.5V STBY=1.5V Io=0.1mA
10.00
VIN=3.5V STBY=1.5V Io=0mA
-40 -15 10 35 60 85
0.00
1.000 0.900 0.800 0.700 0.600 0.500 0.400 0.300 0.200 0.100 0.000 -0.100 -40
G nd Current (uA)
VIN=3.5V STBY=0V
-15
10
35
60
85
Temp (C)
Temp (C)
Temp (C)
Fig. 46. VOUT vs. Temp
Fig. 47. IGND vs. Temp
Fig. 48. IGND vs. Temp (STBY)
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9/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Reference data Vo=1.8V (Ta=25C unless otherwise specified.)
Technical Note
80 70
80 70 Ripple Rejection [dB] 60 50 40 30 20 10 0 2.5
f= 0 .1 kHz
0.7 O u tpu t N oise D e n sity [ V / H z] 0.6 0.5 0.4 0.3 0.2 0.1 0 0.1 1 10 Frequency f [kHz] 100
Co=1.0F Cin=1.0F Iout=10mA temp=25
R ipple R ejection (dB)
60 50 40 30 20 10 0 0.1 1 10 100 1000 Vin= 3.5V Io=10mA Ta = 25
f= 1 kHz f= 1 0 kHz
f= 1 0 0 kHz Co=1.0F Cin=none Iout=10mA temp=25
3.5
4.5
5.5
Frequency (kHz)
Input Voltage VIN[V]
Fig. 49. Ripple Rejection VS Freq.
Fig. 50. Ripple Rejection VS VIN
Fig. 51. Output Noise Spectral Density VS Freq.
Fig. 52. Load Response
Fig. 53. Load Response
Fig. 54. Load Response
Fig. 55. Load Response
Fig. 56. Load Response Current Pulse=10kHz
Fig. 57. Load Response Current Pulse=10kHz
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10/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Reference data Vo=1.8V (Ta=25C unless otherwise specified.)
Technical Note
Fig. 58. Load Response Current Pulse=100kHz
Fig. 59. Load Response Current Pulse=100kHz
Fig. 60. Start Up Time Iout = 0mA
Fig. 61. Start Up Time Iout = 200mA
Fig. 62. Start Up Time (STBY=VIN) Iout = 0mA
Fig. 63. Start Up Time(STBY=VIN) Iout = 200mA
Fig. 64. Discharge Time Iout = 0mA
Fig. 65. VIN Response Iout = 10mA
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11/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Reference data Vo=1.5V (Ta=25C unless otherwise specified.)
Technical Note
1.55
100
1.8
1.54
Output Voltage (V)
Output Voltage (V)
1.5 1.2 0.9 0.6 0.3 0.0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 IO=0uA IO=100uA IO=50mA IO=200mA Temp=25C VIN = STBY
1.52 1.51 1.50 1.49 1.48 1.47 1.46 1.45 1.25 1.35 1.45
Gnd Current (uA)
1.53
IO=0uA IO=100uA IO=50mA IO=200mA
80
60
40
Temp=25C VIN = STBY
1.55 1.65 1.75 1.85 1.95 2.05 2.15 2.25
20
Temp=-40C Temp=25C Temp=85C
IO=0uA VIN = STBY
4 4.5 5 5.5
0 0 0.5 1 1.5 2 2.5 3 3.5
Vin Voltage (V)
Vin Voltage (V)
Vin Voltage (V)
Fig. 66. Output Voltage
Fig. 67. Line Regulation
Fig. 68. Circuit Current IGND
140 120
10
120 110
STBY Current (uA)
Gnd Current (uA)
Gnd Current (uA)
8
Temp=85C Temp=25C Temp=-40C
Temp=85C Temp=25C
100 80 60 40 20 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
100 90 80 70 60 50 40
6
Temp=-40C Temp=25C Temp=85C
4
Temp=-40C
IO=200mA VIN = STBY
2
VIN = STBY
0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
VIN = 3.5V STBY = 1.5V
0 0.05 0.1 0.15 0.2
Vin Voltage (V)
STBY Voltage (V)
Output Current (A)
Fig. 69. Circuit Current IGND
Fig. 70. STBY Input Current
Fig. 71. IOUT - IGND
3.50
2.00
Temp=25
3.00
1.75
Output Voltage (V)
Output Voltage (V)
2.50 VIN=5.5V 2.00 VIN=3.5V 1.50 1.00 VIN=2.0V 0.50 0.00 0 0.1 0.2 0.3 0.4 0.5 0.6
1.50 1.25 1.00 0.75 0.50 0.25 0.00 0 0.5 1 1.5
Temp=85C Temp=25C Temp=-40C
STBY=1.5V
Output Current (A)
STBY Voltage (V)
Fig. 72. Load Regulation
Fig. 73. OCP Threshold
Fig. 74. STBY Threshold
1.55 1.54
50.00
Output Voltage (V)
1.52 1.51 1.50 1.49 1.48 1.47 1.46 1.45 -40 -15 10 35 60 85
Input Current (uA)
1.53
40.00
30.00
20.00
VIN=3.5V STBY=1.5V Io=0.1mA
10.00
VIN=3.5V STBY=1.5V Io=0mA
-40 -15 10 35 60 85
0.00
1.000 0.900 0.800 0.700 0.600 0.500 0.400 0.300 0.200 0.100 0.000 -0.100 -40
Gnd Current (uA)
VIN=3.5V STBY=0V
-15
10
35
60
85
Temp (C)
Temp (C)
Temp (C)
Fig. 75. VOUT vs. Temp
Fig. 76. IGND vs. Temp
Fig. 77. IGND vs. Temp (STBY)
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12/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Reference data Vo=1.5V
80 70
Technical Note
(Ta=25C unless otherwise specified.)
80 70 Ripple Rejection [dB] 60 50 40 30 20 10 0 2.5 3.5 4.5 5.5
100 1000
f= 1 0 0 kHz Co=1.0F Cin=none Iout=10mA temp=25 f= 1 kHz f= 1 0 kHz f= 0 .1 kHz
0.7 O u tpu t N o is e D e n s ity [ V / H z ] 0.6 0.5 0.4 0.3 0.2 0.1 0 0.1 1 10 Frequency f [kHz] 100
Co=1.0F Cin=1.0F Iout=10mA temp=25
Ripple Re je c tion (dB )
60 50 40 30 20 10 0 0.1 1 10 Vin= 3.5V Io=10mA Ta = 25
Frequency (kHz)
Input Voltage VIN[V]
Fig. 78. Ripple Rejection vs. Freq.
Fig. 79. Ripple Rejection vs. VIN (Iout=10 mA)
Fig. 80. Output Noise Spectral Density vs. Freq.
Fig. 81. Load Response
Fig. 82. Load Response
Fig. 83. Load Response
Fig. 84. Load Response
Fig. 85. Load Response Current Pulse=10 kHz
Fig. 86. Load Response Current Pulse=10 kHz
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13/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Reference data Vo=1.5V (Ta=25C unless otherwise specified.)
Technical Note
Fig. 87. Load Response Current Pulse=100 kHz
Fig. 88. Load Response Current Pulse=100 kHz
Fig. 89. Startup Time Iout = 0 mA
Fig. 90. Startup Time Iout = 200 mA
Fig. 91. Startup Time (STBY=VIN) Iout = 0 mA
Fig. 92. Startup Time (STBY=VIN) Iout = 200mA
Fig. 93. Discharge Time Iout = 0 mA
Fig. 94. VIN Response Iout = 10 mA
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14/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Technical Note
About power dissipation (Pd) As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare sufficient margin within power dissipation for usage. Calculation of the maximum internal power consumption of IC (PMAX) PMAX=(VIN-VOUT1)xIOUT1(MAX.)(VIN-VOUT2)xIOUT2(MAX.)(VIN-VOUT3)xIOUT3(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
0.7 0.6 0.5 Pd [W] 0.4 0.3 0.2 0.1 0 0 25 50 Ta [] 75 85 100 125
- Standard ROHM board Size: 70 mm 70 mm 1.6 mm Material: Glass epoxy board
0.66W
* Please design the margin so that PMAX becomes is than Pd (PMAXPd) within the usage temperature range.
Fig.95 VSON008X2030
Power dissipation heat reduction characteristics (Reference)
Notes for use About absolute maximum rating Breakage may occur when absolute maximum ratings such as applied voltage and operating temperature range are exceeded. Short mode or open mode cannot be specified at occurrence of a break, so please prepare physical safety measures (e.g., fuse) if such special mode in which the absolute maximum rating is exceeded can be assumed. About GND potential Please be sure that the potential of the GND terminal is the lowest in any operating condition. About thermal design Please provide thermal design with sufficient margin, taking power dissipation (Pd) in actual usage conditions into consideration. About short between pins and misattachment Please be careful regarding the IC direction and misalignment at attachment onto a printed circuit board. Misattachment may cause a break of IC. Short caused by foreign matter between outputs, output and power supply, or GNDs may also lead to a break. About operation in a strong electromagnetic field Please note that usage in a strong electromagnetic field may cause malfunction. About common impedance Please give due consideration to wiring of the power source and GND by reducing common-mode ripple or making ripple as small as possible (e.g., making the wiring as thick and short as possible, or reducing ripple by LC), etc. About STBY terminal voltage Set STBY terminal voltage to 0.3 V or less to put each channel into a standby state and to 1.5 V or more to put each channel into an operating state. Do not fix STBY terminal voltage to 0.3 V or more and 1.5 V or less or do not lengthen the transition time. This may cause malfunction or failure. When shorting the VIN terminal and STBY terminal for usage, the status will be "STBY=VINLOW" at turning the power OFF, and discharge of the VOUT terminal cannot operate, which means voltage may remain for a certain time in the VOUT terminal. Since turning the power ON again in this state may cause overshoot, turn the power ON for use after the VOUT terminal is completely discharged.
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
15/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Technical Note
About overcurrent protection circuit Output has a built-in overcurrent protection circuit, which prevents IC break at load short. Note that this protection circuit is effective for prevention of breaks due to unexpected accidents. Please avoid usage by which the protection circuit operates continuously. About thermal shutdown Output is OFF when the thermal circuit operates since a temperature protection circuit is built in to prevent thermal breakdown. However, it recovers when the temperature returns to a certain temperature. The thermal circuit operates at emergency such as overheating of IC. Since it is prepared to prevent IC breakdown, please do not use it in a state in which protection works. About reverse current For applications on which reverse current is assumed to flow into IC, it is recommended to prepare a path to let the current out by putting a bypass diode between the VIN-VOUT terminals.
Reverse current
VIN STBY
OUT GND
Fig.96 Example of bypass diode connection About testing on a set board When connecting a capacitor to a terminal with low impedance for testing on a set board, please be sure to discharge for each process since IC may be stressed. As a countermeasure against static electricity, prepare grounding in the assembly process and take sufficient care in transportation and storage. In addition, when connecting a capacitor to a jig in a testing process, please do so after turning the power OFF and remove it after turning the power OFF.
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
16/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Ordering part number
Technical Note
B
U
6
Part No. 6650 6651 6652 6653
6
5
0
N
U
X
-
T
R
Part No.
Package NUX: VSON008X2030
Packaging and forming specification TR: Embossed tape and reel
VSON008X2030
2.00.1
3.00.1

Tape Quantity
S
+0.03 0.02 -0.02 (0.12)
Embossed carrier tape 4000pcs TR
The direction is the 1pin of product is at the upper right when you hold
1PIN MARK
0.6MAX
Direction of feed
( reel on the left hand and you pull out the tape on the right hand
)
0.08 S
1.50.1 0.5
C0.25
0.30.1
8
5
0.25
1.40.1
1
4
+0.05 0.25 -0.04
1pin
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
17/17
2009.09 - Rev.B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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http://www.rohm.com/contact/
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